European regulations regarding (Rb,K,Na,Li,Sr,Ca,Pb) (Al,Fe) Si3O8
R62 Possible risk of impaired fertility.
X: not completely classified!!
|H360Df||May damage the unborn child. Suspected of damaging fertility.|
|H332||Harmful if inhaled.|
|H302||Harmful if swallowed.|
|H373||May cause damage to organs <or state all organs affected, if known> through prolonged or repeated exposure <state route of exposure if it is conclusively proven that no other routes of exposure cause the hazard>.|
|H410||Very toxic to aquatic life with long lasting effects.|
|P201||Obtain special instructions before use.|
|P202||Do not handle until all safety precautions have been read and understood.|
|P260||Do not breathe dust/fume/gas/mist/vapours/spray.|
|P261||Avoid breathing dust/fume/gas/mist/vapours/spray.|
|P264||Wash ... thoroughly after handling.|
|P270||Do no eat, drink or smoke when using this product.|
|P271||Use only outdoors or in a well-ventilated area.|
|P273||Avoid release to the environment.|
|P281||Use personal protective equipment as required.|
|P301+P312||IF SWALLOWED: Call a POISON CENTER or doctor/physician if you feel unwell.|
|P304+P340||IF INHALED: Remove victim to fresh air and keep at rest in a position comfortable for breathing.|
|P308+P313||IF exposed or concerned: Get medical advice/attention.|
|P312||Call a POISON CENTER or doctor/physician if you feel unwell.|
|P314||Get medical advice/attention if you feel unwell.|
|P405||Store locked up.|
|P501||Dispose of contents/container to ...|
Acute Tox. 4 *
Acute Tox. 4 *
STOT RE 2 *
Aquatic Acute 1
Aquatic Chronic 1
|Restriction of the use in electrical and electronic equipment||RoHS
5. Lead in glass of cathode ray tubes, electronic components and fluorescent tubes.
6. Lead as an alloying element in steel containing up to 0,35 % lead by weight, aluminium containing up to 0,4 % lead by weight and as a copper alloy containing up to 4 % lead by weight.
7. - Lead in high melting temperature type solders (i.e. lead-based alloys containing 85 % by weight or more lead),
- lead in solders for servers, storage and storage array systems, network infrastructure equipment for switching, signalling, transmission as well as network management for telecommunications,
- lead in electronic ceramic parts (e.g. piezoelectronic devices).
9b. Lead in lead-bronze bearing shells and bushes.
11. Lead used in compliant pin connector systems.
12. Lead as a coating material for the thermal conduction module c-ring.
13. Lead and cadmium in optical and filter glass.
14. Lead in solders consisting of more than two elements for the connection between the pins and the package of microprocessors with a lead content of more than 80 % and less than 85 % by weight.
15. Lead in solders to complete a viable electrical connection between semiconductor die and carrier within integrated circuit Flip Chip packages.
16. Lead in linear incandescent lamps with silicate coated tubes.
17. Lead halide as radiant agent in High Intensity Discharge (HID) lamps used for professional reprography applications.
18. Lead as activator in the fluorescent powder (1 % lead by weight or less) of discharge lamps when used as sun tanning lamps containing phosphors such as BSP (BaSi2O5:Pb) as well as when used as speciality lamps for diazo-printing reprography, lithography, insect traps, photochemical and curing processes containing phosphors such as SMS ((Sr,Ba)2MgSi2O7:Pb).
19. Lead with PbBiSn-Hg and PbInSn-Hg in specific compositions as main amalgam and with PbSn-Hg as auxiliary amalgam in very compact Energy Saving Lamps (ESL).
20. Lead oxide in glass used for bonding front and rear substrates of flat fluorescent lamps used for Liquid Crystal Displays (LCD).
21. Lead and cadmium in printing inks for the application of enamels on borosilicate glass.
22. Lead as impurity in RIG (rare earth iron garnet) Faraday rotators used for fibre optic communications systems.
23. Lead in finishes of fine pitch components other than connectors with a pitch of 0.65 mm or less with NiFe lead frames and lead in finishes of fine pitch components other than connectors with a pitch of 0.65 mm or less with copper lead frames.
24. Lead in solders for the soldering to machined through hole discoidal and planar array ceramic multilayer capacitors.
25. Lead oxide in plasma display panels (PDP) and surface conduction electron emitter displays (SED) used in structural elements; notably in the front and rear glass dielectric layer, the bus electrode, the black stripe, the address electrode, the barrier ribs, the seal frit and frit ring as well as in print pastes.
26. Lead oxide in the glass envelope of Black Light Blue (BLB) lamps.
27. Lead alloys as solder for transducers used in high-powered (designated to operate for several hours at acoustic power levels of 125 dB SPL and above) loudspeakers.
29. Lead bound in crystal glass as defined in Annex I (Categories 1, 2, 3 and 4) of Council Directive 69/493/EEC
31. Lead in soldering materials in mercury free flat fluorescent lamps (which e.g. are used for liquid crystal displays, design or industrial lighting).
32. Lead oxide in seal frit used for making window assemblies for Argon and Krypton laser tubes.
33. Lead in solders for the soldering of thin copper wires of 100 μm diameter and less in power transformers.
34. Lead in cermet-based trimmer potentiometer elements.
37. Lead in the plating layer of high voltage diodes on the basis of a zinc borate glass body.
File created on 2009/18/08 by LCI Publisher GmbH (Gaja Peters, Inga Thede, Volkmar Vill, Ron Zenczykowski)
© 2009 Landolt Börnstein, Springer-Verlag Berlin Heidelberg